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TSMC is advancing an EMIB-like advanced-packaging technology while its 1.4nm fab construction in central Taiwan runs ahead of schedule.

Trendforce+2 · 前天
INTCTSM
TSMC is advancing an EMIB-like advanced-packaging technology while its 1.4nm fab construction in central Taiwan runs ahead of schedule.
  • TSMC is developing an EMIB-like packaging approach to compete with Intel's EMIB technology as demand for AI chip integration increases pressure on existing CoWoS capacity.
  • Construction of TSMC's 1.4nm fab in central Taiwan is ahead of schedule, with the first fab building expected to be completed before April 2027.
  • Supply-chain sources cited by TrendForce expect pilot production and mass production timing to accelerate if construction continues at its current pace, with mass production seen by mid-2028.

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