
- Taiwan Semiconductor Manufacturing Co. (TSMC) announced plans to invest an additional $100 billion in the United States to construct several new cutting-edge chipmaking facilities.
- The investment includes the development of advanced packaging plants in Arizona, a critical component for AI chip production.
- Following the AI investment boom, TSMC has raised its full-year capital expenditure to $64 billion and increased its revenue growth forecast to 40%.
Quotes
“Taiwan Semiconductor Manufacturing Co. on Thursday announced it will invest an additional $100 billion in the U.S. to build several more cutting-edge chipmaking facilities as well as advanced packaging plants in Arizona.”