- TSMC reported record Q3 2026 revenue of about NT$1.49 trillion, up 50% year over year, driven by strong AI chip demand.
- A multi-year US$2 billion supply and production expansion agreement with GlobalFoundries focuses on silicon interposers for advanced packaging.
- New US domestic output in Malta, New York starts in 2028 to support TSMC's CoWoS advanced packaging capacity for high-performance computing and AI clients.
- The full Q3 earnings release is scheduled for October 15, with focus on Q4 guidance and 2027 AI chip demand.
- Gross margin above the 65%-67% guidance range is a key watch item for investors tracking 2nm ramp costs.
Quotes
“The deal helps alleviate industry capacity constraints in packaging and reinforces TSMC's role as a key AI chip production partner”
“TSMC reported record Q3 revenue of $46.7 billion, a 50% year-over-year increase that exceeded its own guidance”