- AMD announced more than $10 billion in investments across the Taiwan ecosystem, targeting advanced packaging, chiplet architectures and rack-scale manufacturing for next-generation AI infrastructure.
- AMD and ODM partners Sanmina, Wiwynn, Wistron and Inventec are building AMD Helios rack-scale systems powered by Instinct MI450X GPUs, 6th Gen EPYC CPUs and the ROCm software stack, with deployment targeted for H2 2026.
- Packaging partners ASE, SPIL, PTI and Unimicron are industrializing Elevated Fanout Bridge (EFB), including panel-based EFB, to lift advanced packaging volume and cost efficiency for chips such as 'Venice'.
- AMD granted OpenAI and Meta warrants for up to 320 million shares, 160 million each, at $0.01 per share; they vest on commitments to buy up to 6 gigawatts of Instinct MI450-series GPUs over five years and on AMD's stock reaching targets up to $600. Full exercise would dilute shares by roughly 19.6%, and none had vested as of mid-2026.
- AMD guided Q3 2026 revenue to roughly $13 billion, 16.1% above its Q2 guide and 13% above reported Q2 revenue of $11.5 billion, on strong double-digit data center and embedded growth against a modest decline in client and gaming. Management projects data center revenue to more than double in 2027.
- AMD shares rose 26.0% from the August 4, 2026 guidance through September 29, 2026, holding above their 50-day and 200-day moving averages while trading at 154.1 times trailing earnings.
Quotes
“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand. By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.”
“Sanmina is proud to partner with AMD to deliver next-generation AI infrastructure at scale. Our work together on AMD Helios manufacturing highlights the strength of the ecosystem and our shared commitment to delivering high-performance, reliable solutions to customers worldwide.”
“Wiwynn's collaboration with AMD on the Helios platform reflects our commitment to delivering fully integrated, rack-scale AI infrastructure. Together, we are empowering hyperscalers to deploy AI at scale with the performance, efficiency and reliability the market demands.”
“Our collaboration with AMD on Elevated Fanout Bridge technology represents a significant step forward in scaling advanced packaging for high-volume applications. By working together to industrialize EFB, we are enabling greater performance, efficiency and flexibility for next-generation data center platforms.”
“Through our work with AMD on panel-based EFB, we are delivering new levels of scalability and cost efficiency for advanced packaging. This collaboration enables faster time-to-market and supports the high-volume production requirements of next-generation processors like 'Venice.”